Search Results for Computer aided engineering - Narrowed by: Perpustakaan JabatanSirsiDynix Enterprisehttp://kllibrary.dbkl.gov.my/client/en_US/pkl/pkl/qu$003dComputer$002baided$002bengineering$0026qf$003dLIBRARY$002509Library$0025091$00253APJ$002509Perpustakaan$002bJabatan$0026ic$003dtrue$0026ps$003d300?dt=list2025-09-10T19:12:39ZTools For Design Using AutoCad 2018 And Autodesk Inventor 2018 : Hnad Sketching,2D Drawing And 3D Modelingent://SD_ILS/0/SD_ILS:2672632025-09-10T19:12:39Z2025-09-10T19:12:39ZShih, Randy H<br/>2017<br/>Perpustakaan Jabatan<br/>ISBN 9781630571276<br/>Motion Simulation And Mechanism Design With Solidworks Motion 2017/ Kuang-Hua Changent://SD_ILS/0/SD_ILS:2672512025-09-10T19:12:39Z2025-09-10T19:12:39ZChang, Kuang-Hua<br/>2017<br/>Perpustakaan Jabatan<br/>ISBN 9781630570828<br/>Introduction To Finite Element Analysis Using Solidworks Simulation 2017ent://SD_ILS/0/SD_ILS:2672552025-09-10T19:12:39Z2025-09-10T19:12:39ZShih, Randy H.<br/>2017<br/>Perpustakaan Jabatan<br/>ISBN 9781630570774<br/>CATIA V6 essentialsent://SD_ILS/0/SD_ILS:2164242025-09-10T19:12:39Z2025-09-10T19:12:39Z2011<br/>Perpustakaan Jabatan<br/>ISBN 9780763785161<br/>Structural dynamics of electronic and photonic systemsent://SD_ILS/0/SD_ILS:2172582025-09-10T19:12:39Z2025-09-10T19:12:39ZSuhir, Ephraim Yu, T. X. (Tongxi), 1941- Connally, Eric<br/>"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"-- "The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"--<br/>2011<br/>Perpustakaan Jabatan<br/>ISBN 9780470250020<br/>Solid modeling : using pro/engineer wildfireent://SD_ILS/0/SD_ILS:826072025-09-10T19:12:39Z2025-09-10T19:12:39ZAdewale, Ajayi O.<br/>2006<br/>Perpustakaan Jabatan<br/>ISBN 9781418005641<br/>