Search Results for Discussion - Narrowed by: Perpustakaan JabatanSirsiDynix Enterprisehttp://kllibrary.dbkl.gov.my/client/en_US/pkl/pkl/qu$003dDiscussion$0026qf$003dLIBRARY$002509Library$0025091$00253APJ$002509Perpustakaan$002bJabatan$0026ps$003d300?2026-05-20T06:36:03ZAir conditioning and refrigerationent://SD_ILS/0/SD_ILS:2164862026-05-20T06:36:03Z2026-05-20T06:36:03ZMiller, Rex, 1929- Miller, Mark R.<br/>"Fully updated to cover the latest developments in air conditioning and refrigeration. Air Conditioning and Refrigeration, Second Edition, an introduction to the basic principles and practices of the air conditioning and refrigeration industry, contains all of the task-simplifying details needed for any project. Featuring more than 800 illustrations, the book provides step-by-step instructions for efficient, cost-effective, and current methods for choosing, installing, maintaining, troubleshooting, servicing, and repairing today's air conditioning and refrigeration equipment.New to this Edition: 16-page color insert Updated coverage of solenoids and valves EPA mandates for refrigerants and site safety Updated discussion of compressors Coverage of residential air conditioning units"-- "Fully updated to cover the latest developments in air conditioning and refrigeration, this is a must-have resource for beginners and seasoned AC professionals alike"--<br/>2012<br/>Perpustakaan Jabatan<br/>ISBN 9780071761390<br/>Structural dynamics of electronic and photonic systemsent://SD_ILS/0/SD_ILS:2172582026-05-20T06:36:03Z2026-05-20T06:36:03ZSuhir, Ephraim Yu, T. X. (Tongxi), 1941- Connally, Eric<br/>"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"-- "The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"--<br/>2011<br/>Perpustakaan Jabatan<br/>ISBN 9780470250020<br/>