"Betty Crocker Big Book of Slow Cooker, Casseroles, and More! combines slow cooker, comfort food and one dish meals into one big compendium, with a focus on ease and convenience, answering consumer demand for simple mealtime solutions in an affordable, high-value package.This book collects favorite recipes Betty Crocker readers have come to trust for simple solutions for home-cooked meals and modern twists to comfort food classics. Every recipe delivers on this no-fuss promise, utilizing convenience appliances such as a slow cooker, or only one essential pot or pan, like a casserole dish or skillet, to get dinner on the table quickly and efficiently. More than 250 no-fuss recipes, from comforting casseroles and pasta favorites to hearty soups and stews and light and fresh accompaniments, with beautiful 4-color photos throughout. Bonus dessert and appetizer chapters offer clever ideas for holiday and entertaining meals. Special features in each chapter will offer valuable advice on making crowd-pleasing dishes for entertaining, big batch cooking ideas, clever ways to use up leftovers, and I-didn't-know-I-could-do-that snacks and drinks made with a slow cooker. Icons to highlight vegetarian dishes and super-fast recipes that can be prepared in 30 minutes or less. Introductory section will include helpful tips and information on optimizing a slow cooker, make-ahead recipe suggestions, and ways to speed up dinnertime prep."--

"The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components' level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice"-- "The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading"--